Resin composition and method of forming resist pattern
AssigneeJsr Corporation
InventorsTomohiko Sakurai, Sosuke Osawa, Hiromitsu Nakashima
Life of this patent
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Abstract
A resin composition includes a resin A, a resin C, and a solvent. The resin A includes a sulfonic-acid-group-containing structural unit in an amount exceeding 5 mol % with respect to total structural units included in the resin A. The resin A has a content of a fluorine atom of 30 mass % or less with respect to a total mass of the resin A. The resin C includes a fluorine atom in a larger content per unit mass than the content of a fluorine atom per unit mass in the resin A. A content of the resin A in the resin composition is lower than a content of the resin C in the resin composition in terms of mass.
Claims20
A resin composition comprising:
- a resin A that comprises a sulfonic-acid-group-containing structural unit in an amount exceeding 5 mol % with respect to total structural units included in the resin A, the resin A having a content of a fluorine atom of 30 mass % or less with respect to a total mass of the resin A;
- a resin C that comprises a fluorine atom in a larger content per unit mass than the content of a fluorine atom per unit mass in the resin A;
- and
- a solvent,
- wherein a content of the resin A in the resin composition is lower than a content of the resin C in the resin composition in terms of mass, and a content of the resin A in a total mass of resin solid components of the resin composition is 0.1 mass % or more and less than 5 mass %.
Dependencies are inferred from the claim text.