Temperature modulation assembly and a multi-layer retention mechanism for a temperature therapy device

Abstract

A temperature modulation assembly and a multi-layer retention mechanism for such a temperature therapy device are disclosed. According to one embodiment, a temperature modulation assembly for a temperature therapy device has a heat spreader and a mounting plate coupled to a bottom portion of a spacer, wherein the heat spreader is disposed between the mounting plate and the spacer. The temperature modulation assembly has a heatsink and a fan coupled to a top portion of the spacer, wherein the heatsink is disposed between the top portion of the spacer and the fan. The temperature modulation assembly further includes a heating and/or cooling device disposed within a central opening of the spacer, wherein the heating and/or cooling device is located between the heatsink and the heat spreader.

Dependencies are inferred from the claim text.