High-frequency module

A high-frequency module comprising:

• a wiring board;
• a first component and a second component mounted on a main surface of the wiring board;
• and
• a shield member arranged between the first component and the second component, wherein the shield member includes one or more metal pins, each of the one or more metal pins having a predominant length and being arranged such that a direction of the predominant length is substantially parallel to the main surface of the wiring board,
• wherein the one or more metal pins include a plurality of first metal pins,
• wherein each first metal pin is arranged so as to overlap with another first metal pin when viewed from a direction perpendicular to the main surface of the wiring board, and
• wherein the one or more metal pins further includes a plurality of second metal pins, each second metal pin being spaced apart from the first component and arranged at a position overlapping with the first component when viewed from the direction perpendicular to the main surface.

A high-frequency module comprising:

• a wiring board;
• a first component and a second component mounted on a main surface of the wiring board;
• a shield member arranged between the first component and the second component;
• a sealing resin layer including a contact surface making contact with the main surface of the wiring board, an opposing surface opposing to the contact surface, and a side surface for connecting end edges of the contact surface and the opposing surface to each other, wherein the sealing layer seals the first component and the second component;
• and
• a shield film for covering at least the opposing surface and the side surface of the sealing resin layer,
• wherein the shield member includes one or more metal pins, each of the one or more metal pins comprising an elongated body that is predominantly elongated in a direction substantially parallel to the main surface of the wiring board,
• wherein the one or more metal pins include a plurality of first metal pins,
• wherein each first metal pin is arranged so as to overlap with another first metal pin when viewed from a direction perpendicular to the main surface of the wiring board, and
• wherein an end portion of each of the plurality of first metal pins is exposed to the side surface of the sealing resin layer and connected to the shield film.