Double-sided hybrid cooling of PCB embedded power electronics and capacitors

A power control unit (PCU) comprising:

• a power device embedded printed circuit board (PCB) comprising one or more power devices embedded within the power device embedded PCB;
• and
• a cold plate coupled to the power device embedded PCB, wherein the cold plate comprises:
• a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface;
• a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface;
• a manifold comprising an internal cavity defined by a first length, a first width, and a first height;
• and
• a flow divider defined by a second length, a second width, and a second height, wherein:
• the manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height,
• the flow divider is positioned within the internal cavity of the manifold, and
• the flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider,
• wherein the power device embedded PCB is coupled to the cold plate on an exterior surface of the first cooling surface.

A cooling system comprising:

• a fluid reservoir;
• a pump fluidly coupled to the fluid reservoir;
• and
• a cold plate comprising:
• a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface;
• a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface;
• a manifold comprising:
• an internal cavity defined by a first length, a first width, and a first height, and
• an inlet port, a vapor outlet port, and a liquid outlet port, each extending from an exterior surface of the manifold into the internal cavity;
• and
• a flow divider defined by a second length, a second width, and a second height, wherein:
• the manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height,
• the flow divider is positioned within the internal cavity of the manifold, and
• the flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider,
• wherein:
• the pump is fluidly coupled to the inlet port of the manifold, and
• the liquid outlet port and the vapor outlet port are fluidly coupled to the fluid reservoir.