Cooling computing modules of a rack-mountable tray

An apparatus, comprising:

• a rack-mountable tray, including:
• a plurality of bays and a plurality of thermal pads, each bay of the plurality of bays including i) a respective thermal pad of the plurality of thermal pads, ii) a cold fluid intake, and iii) a warm fluid return, wherein each computing module of a plurality of computing modules is engaged with the cold fluid intake and the warm fluid return of a respective bay of the plurality of bays, and a thermal plate of the computing module is in thermal communication with the thermal pad of the respective bay to transfer heat from the thermal plate of the computing module to the thermal pad of the respective bay;
• and
• a fluid circulation system positioned with in the rack-mountable tray, the fluid circulation system including a cold fluid intake line coupled to the cold fluid intake of each of the plurality of bays and a warm fluid return line coupled to the warm fluid return of each of the plurality of bays, the fluid circulation system:
• introducing, for each bay that a respective computing module of the plurality of computing modules is engaged with, a fluid within the computing module via the cold fluid intake of the bay to transfer heat from components of the computing module to the fluid and transfer heat from the fluid to the thermal plate of the computing module and returning warm fluid via the warm fluid return of the bay, and
• circulating, for each bay of the plurality of bays that a respective computing module of the plurality of computing modules is engaged with, additional fluid via the cold fluid intake line proximate to the thermal pad of the bay to transfer heat from the thermal pad to the additional fluid and return the additional fluid via the warm fluid return line.

A method of cooling a plurality of computing modules, comprising:

• engaging each computing module of the plurality of computing modules with a respective bay of a plurality of bays of a rack mountable tray, including engaging each computing module of the plurality of computing modules with a cold fluid intake and a warm fluid return of the respective bay, such that, for each computing module, a thermal plate of the computing module is positioned proximate to a thermal pad of the respective bay to place the thermal pad of the respective bay in thermal communication with the thermal plate of the computing module to transfer heat form the thermal plate of the computing module to thermal pad of the respective bay;
• introducing fluid, for each computing module of the plurality of computing modules, within the computing module via the cold fluid intake of the respective bay that is engaged with the computing module and coupled to a cold fluid intake line to transfer heat from components of the computing module to the fluid and transfer heat from the fluid to the thermal plate of the computing module and returning warm fluid via the warm fluid return of the respective bay that is engaged with the computing module and coupled to a warm fluid return line;
• and
• circulating, for each bay of the plurality of bays that a respective computing module of the plurality of computing modules is engaged with, additional fluid via the cold fluid intake line proximate to the thermal pad of the bay to transfer heat from the thermal pad to the additional fluid and return the additional fluid via the warm fluid return line.