Liquid-cooling heat dissipation device
AssigneeCooler Master Co., Ltd.
InventorTung-Yang Shieh
Life of this patent
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Abstract
The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.
Claims13
A liquid-cooling heat dissipation device, configured to be in thermal contact with an expansion card, comprising:
- a base plate, configured to be mounted on the expansion card;
- a thermally-conductive component, mounted on the base plate, wherein the thermally-conductive component and the base plate together form a liquid chamber therebetween;
- and
- a heat exchanger, mounted on the base plate and connected to the liquid chamber;
- wherein the base plate comprises a plate body, the plate body has a first surface and a second surface, the first surface faces away from the heat exchanger, the second surface faces away from the first surface and faces the heat exchanger, and the liquid chamber is on the first surface of the plate body facing away from the heat exchanger;
- wherein the liquid-cooling heat dissipation device further comprises a sealing component surrounding the liquid chamber and located between and clamped by the thermally-conductive component and the first surface of the plate body;
- wherein the plate body has two through holes, and the liquid chamber is located between the two through holes.
Dependencies are inferred from the claim text.