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US 11,602,067 B2Granted
Backplane and method for producing same
AssigneeSiemens Aktiengesellschaft
InventorJoachim Seidl
Life of this patent
Estimating the term…
Abstract
A backplane is for electrically connecting electrical components and a method is for producing a backplane. The backplane includes a base board, conducting tracks arranged on and/or in the base board, and at least one actuator unit arranged on or in the base board.
Claims13
A backplane for electrically connecting electrical components, the backplane comprising:
- a carrier plate;
- conductor paths, each of the conductor paths running at least one of on the carrier plate and in the carrier plate;
- and
- a plurality of actuator units, arranged in the carrier plate, wherein at least one actuator unit is embodied as a microsystem, wherein the plurality of actuator units are arranged in a plurality of layers in the carrier plate, and wherein at least one conductor path is embedded between the plurality of layers and the at least one conductor path is disposed in at least two of the plurality of layers, the conductor paths being disposed between and interconnecting the plurality of actuator units, wherein the carrier plate is produced, at least in a region surrounding the plurality of actuator units, using a 3D printing, so that the at least plurality of actuator units are embedded into the carrier plate.
1 more element
Dependencies are inferred from the claim text.