Overmolded components having sub-flush residuals

An electronic system comprising:

• a battery cell characterized by a height, wherein the battery cell includes an electrode tab exiting from an edge of a first side of the battery cell;
• and
• a module electrically coupled with the battery cell, the module comprising:
• a circuit board including a conductive tab extending from a first side of the circuit board and a flexible coupling extending from a second side of the circuit board normal to the first side of the circuit board, wherein the conductive tab is electrically coupled with the electrode tab, wherein the circuit board comprises a first surface from which an electronic component extends and a second surface opposite the first surface, wherein the circuit board is characterized by a width across the circuit board, wherein the circuit board is characterized by a thickness, and wherein the circuit board is formed from rigid-flex circuit board material and comprises a tie-bar residual of the rigid-flex circuit board material extending beyond the width across the first surface from a second side of the circuit board opposite the first side of the circuit board, and
• an overmold at least partially encapsulating the circuit board, wherein the conductive tab penetrates the overmold, wherein the overmold is characterized by a first height extending normal to the first surface of the circuit board across the width of the circuit board, wherein the overmold extends laterally beyond the width of the first surface along a length of the first surface, wherein the overmold defines a region about the tie-bar residual characterized by a recessed height from the first height, wherein the overmold defines a notch within the region recessed from an outer edge of the overmold, wherein the notch is located across the tie-bar residual, and wherein an outer face of the tie-bar residual is aligned with a portion of an outer surface of the notch.