Printed circuit board with embedded bridge
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMoon Seok Heo, Hyung Ki Lee
Life of this patent
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Abstract
A printed circuit board with an embedded bridge includes: a first connection structure including a first insulating film; a bridge disposed on the first connection structure and having one surface, in contact with the first insulating film; and a second connection structure disposed on the first connection structure, and including a second insulating film. The second insulating film covers at least a portion of the other surface of the bridge.
Claims20
A printed circuit board with an embedded bridge, comprising:
- a first connection structure including a first insulating film;
- a bridge disposed on the first connection structure, and having one surface in contact with the first insulating film;
- and
- a second connection structure disposed on the first connection structure, and including a second insulating film disposed directly on the first insulating film in a stacking direction,
- wherein the second insulating film covers at least a portion of another surface of the bridge, opposite to the one surface of the bridge, and
- wherein the first and second insulating films define an interface therebetween which overlaps the bridge in a direction perpendicular to the stacking direction.
A printed circuit board with an embedded bridge, comprising:
- a first insulating film;
- a bridge disposed on the first insulating film;
- and
- a second insulating film covering an upper surface of the first insulating film and the bridge, respectively,
- wherein the upper surface of the first insulating film, directly contacting a side surface of the bridge in a direction perpendicular to a thickness direction of the bridge, and a lower surface of the bridge define a step, and
- wherein the first and second insulating films define an interface therebetween which overlaps the bridge in the direction perpendicular to the thickness direction.
A printed circuit board with an embedded bridge, comprising:
- an insulating layer;
- a first wiring layer disposed on the insulating layer;
- a first insulating film disposed on the insulating layer and covering the first wiring layer;
- a bridge disposed on the first insulating film;
- a second insulating film disposed directly on the first insulating film in a stacking direction and covering the bridge;
- a second wiring layer disposed on the second insulating film;
- a first via extending from the second wiring layer to connect to the bridge;
- and
- a second via extending from the second wiring layer to contact the first wiring layer,
- wherein the first and second insulating films define an interface therebetween which overlaps the bridge in a direction perpendicular to the stacking direction.
Dependencies are inferred from the claim text.