Driver board assemblies and methods of forming the same
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorFeng Zhou
Life of this patent
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Abstract
A method of manufacturing a driver board assembly includes embedding one or more power device assemblies within a first PCB material layer, forming one or more cooling channels within a surface of the first PCB material layer such that the one more cooling channels extend proximate to the one or more power device assemblies, forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels, and bonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.
Claims20
A method of manufacturing a driver board assembly, the method comprising:
- encapsulating one or more power device assemblies within a first layer of a printed circuit board (PCB) such that the first layer surrounds the one or more power device assemblies;
- forming a first portion of one or more cooling channels within a surface of the first layer such that the one or more cooling channels extend proximate to the one or more power device assemblies;
- forming a second portion of the one or more cooling channels within a surface of a second layer of the PCB;
- forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels;
- and
- bonding the second layer and the first layer such that the first portion and the second portion are aligned to define and to enclose the one or more cooling channels between the first layer and the second layer.
A driver board assembly, comprising:
- a first layer of a PCB;
- one or more power device assemblies embedded within the first layer, the first layer encapsulating the one or more power device assemblies, the first layer surrounds the one or more power device assemblies;
- one or more cooling channels formed within a surface of the first layer such that the one or more cooling channels extend proximate to the one or more power device assemblies;
- a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels;
- and
- a second layer of the PCB bonded to the first layer to enclose the one or more cooling channels between the first layer and the second layer,
- wherein each of the one or more cooling channels is at least partially formed in each of the first layer and the second layer.
A driver board assembly, comprising:
- a first layer of a PCB;
- one or more power device assemblies embedded within the first layer, the first layer encapsulating the one or more power device assemblies, the first layer surrounds the one or more power device assemblies;
- one or more cooling channels formed within a surface of the first layer such that the one or more cooling channels extend proximate to the one or more power device assemblies;
- and
- a second layer of the PCB bonded to the first layer to enclose the one or more cooling channels between the first layer and the second layer,
- wherein each of the one or more cooling channels is at least partially formed in each of the first layer and the second layer.
Dependencies are inferred from the claim text.