Cooling packages for heterogenous chips
AssigneeBaidu USA LLC
InventorTianyi Gao
Life of this patent
Estimating the term…
Abstract
Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.
Claims13
A system for cooling a heterogeneous computing architecture, comprising:
- a base stiffener;
- a top stiffener including a mounting channel, wherein the top stiffener includes a first side, a second side, a third side, and a fourth side, the first side being a closed end, the second side being an open end, and each of the third side and fourth side including two resistance channels, wherein a first resistance channel on either of the third side and fourth side is on top of the mounting channel, and wherein a second resistance channel on either of the third side and fourth side is below the mounting channel;
- a printed circuit board (PCB) including a plurality of hardware modules, the PCB attached to the base stiffener;
- a cooling device mounted on top of the top stiffener;
- and
- a plurality of heat transfer plates (HTPs) disposed in the mounting channel of the top stiffener, wherein each of the plurality of HTPs is separate from the cooling device, and is in contact with an external surface of each of one or more of the plurality of hardware modules to transfer heat generated by the plurality of hardware modules to the cooling device.
An electronic rack of a data center, comprising:
- a plurality of server chassis arranged in a stack, each server chassis including
- one or more servers and each server including a plurality of hardware modules mounted on a printed circuit board (PCB);
- and
- a cooling system, including:
- a base stiffener, wherein the PCB is attached to the base stiffener;
- a top stiffener including a mounting channel, wherein the top stiffener includes a first side, a second side, a third side, and a fourth side, the first side being a closed end, the second side being an open end, and each of the third side and fourth side including two resistance channels, wherein a first resistance channel on either of the third side and fourth side is on top of the mounting channel, and wherein a second resistance channel on either of the third side and fourth side is below the mounting channel;
- a cooling device mounted on top of the top stiffener;
- and
- a plurality of heat transfer plates (HTPs) disposed in the mounting channel of the top stiffener, wherein each of the plurality of HTPs is separate from the cooling device, and is in contact with an external surface of each of one or more of the plurality of hardware modules to transfer heat generated by the plurality of hardware modules to the cooling device.
Dependencies are inferred from the claim text.