Integrated sub-assembly for wearable audio device
AssigneeDopple IP B.V.
InventorJohannes Lucas Schreuder
Life of this patent
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AssigneeDopple IP B.V.
InventorJohannes Lucas Schreuder
Estimating the term…
An audio headset sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) providing the operative functionality for true wireless headphones/headset (100) includes circuitry operative to effect wireless communication and audio signal processing, and a battery (212). These circuits and battery (212) are contained in a sealed enclosure (610, 710, 1210, 1310). In one embodiment, the sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) includes all electronic components for wireless communications and audio signal processing, and a battery (212), but does not include a speaker. A microphone (240) may be part of the sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) or may be external. In another embodiment, a speaker (230) is part of the sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) as well. The sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) may include several cavities (1254, 1252) and vents (1264, 1262) before and behind the speaker (230) for optimal acoustic performance. The sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500), and any necessary external audio components, can be inserted in an external housing (104) forming the visual product appearance and the anthropometric comfort and fit design of a true wireless headphone or headset (100).
An audio headset sub-assembly, comprising a battery and a folded electronics construction, comprising two or more rigid circuit boards connected by at least one flexible circuit board and folded around the battery, placed together in a contained enclosure separate from a housing that contains it, the folded electronics construction holding components implementing functionality including:
A method of manufacturing an audio headset sub-assembly characterized by:
Dependencies are inferred from the claim text.