Power amplifier module, frontend circuit, and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorIsao Takenaka
Life of this patent
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AssigneeMurata Manufacturing Co., Ltd.
InventorIsao Takenaka
Estimating the term…
A PA module includes: a multilayer substrate having a ground pattern layer connected to a ground of a power source; amplifier transistors disposed on the multilayer substrate; a bypass capacitor having one end connected to the collector of the amplifier transistor; a first wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a second wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a third wiring line connecting the other end of the bypass capacitor and the ground pattern layer to each other; and a fourth wiring line formed between the amplifier transistor and the ground pattern layer and between the bypass capacitor and the ground pattern layer and connecting the first wiring line and the third wiring line to each other.
A power amplifier module, comprising:
A power amplifier module, comprising:
A power amplifier module, comprising:
Dependencies are inferred from the claim text.