Connection terminal pattern and layout for three-level buck regulator
AssigneeQUALCOMM Incorporated
InventorsChengyue Yu, Zhen Ning Low, Guoyong Guo, Jiwei Chen
Life of this patent
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Abstract
Certain aspects of the present disclosure generally relate to a connection terminal pattern and layout for a three-level buck regulator. One example electronic module generally includes a substrate, an integrated circuit (IC) package disposed on the substrate and comprising transistors of a three-level buck regulator, a capacitive element of the three-level buck regulator disposed on the substrate, and an inductive element of the three-level buck regulator disposed on the substrate. In certain aspects, the capacitive element and the inductive element may be disposed adjacent to different sides of the IC package.
Claims16
An electric module, comprising:
- a substrate;
- an integrated circuit (IC) package disposed on the substrate and comprising transistors of a three-level buck regulator;
- a capacitive element of the three-level buck regulator disposed on the substrate, wherein the capacitive element comprises a flying capacitor;
- and
- an inductive element of the three-level buck regulator disposed on the substrate, the capacitive element and the inductive element being disposed adjacent to different sides of the IC package, wherein:
- the different sides of the IC package comprise a first surface and a second surface, the first and second surfaces being adjacent surfaces sharing a common edge;
- an entirety of a length of the capacitive element is disposed along the first surface;
- and
- an entirety of a length of the inductive element is disposed along the second surface.
A method for voltage regulation, comprising:
- selectively coupling, via a plurality of transistors of a three-level buck regulator, a capacitive element between a switching node and a voltage rail or a reference potential node, the plurality of transistors being integrated in an integrated circuit (IC) package on a substrate;
- and
- generating an output voltage at an output node of the three-level buck regulator having an inductive element coupled between the switching node and the output node, the capacitive element and the inductive element being disposed adjacent to different sides of the IC package on the same layer of the substrate, wherein:
- the capacitive element comprises a flying capacitor;
- the different sides of the IC package comprise a first surface and a second surface,
- the first and second surfaces being adjacent surfaces sharing a common edge;
- an entirety of a length of the capacitive element is disposed along the first surface;
- and
- an entirety of a length of the inductive element is disposed along the second surface.
Dependencies are inferred from the claim text.