US 11,600,932 B2Granted

Antenna-on-package including multiple types of antenna

AssigneeTexas Instruments Incorporated

InventorsYiqi Tang, Rajen Manicon Murugan

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Abstract

An AIP includes a package substrate including a top layer including a top metal layer including a first antenna type and a second antenna type, and a bottom layer including a bottom dielectric and a metal layer including a first and second contact pad and filled vias, and an IC embedded therein. Bond pads of an IC are coupled by a connection including ≥1 filled via for connecting to the top and/or bottom metal layer. A first metal pillar is between the first contact pad and first antenna, and a second metal pillar is between the second contact pad and second antenna. A first filled via is coupled to the first metal pillar providing a transmission line from the first contact pad to the first antenna. A second filled via is coupled to the first metal pillar providing a transmission line from the second contact pad to the second antenna.

Claims20

Dependent claims

An antenna in package (AIP), comprising:

an integrated circuit (IC) die comprising a substrate including a top side semiconductor surface including circuitry having a plurality of bond pads electrically connected to nodes in the circuitry;
a package substrate including the IC die mounted with a top side up, wherein the IC die is completely embedded therein, the package substrate comprising a top layer including a top dielectric layer and a top metal layer including a first antenna of a first antenna type and a second antenna of a second antenna type, and a bottom layer including a bottom dielectric layer and a bottom metal layer including a plurality of contact pads including a first contact pad, a second contact pad, and a plurality of filled vias;
the plurality of bond pads electrically coupled by a via-comprising die connection including at least one of the pluralities of filled vias for connecting to at least one of the top metal layer and the bottom metal layer, and
a plurality of metal pillars including a first metal pillar electrically coupled between the first contact pad and the first antenna and a second metal pillar electrically coupled between the second contact pad and the second antenna, and
wherein at least a first of the plurality of filled vias is electrically coupled to the first metal pillar for providing a first transmission line from the first contact pad to the first antenna, and wherein at least a second of the plurality of filled vias is electrically coupled to the first metal pillar for providing a second transmission line from the second contact pad to the second antenna.

2 more elements

A method of forming an antenna in package (AIP), comprising:

forming a bottom layer on a carrier, the bottom are layer including a bottom metal layer, a bottom dielectric layer, and bottom filled vias on the bottom metal layer, the bottom metal layer providing a plurality of contact pads including a first antenna contact pad, a second antenna contact pad, and a first of the bottom filled vias on the first antenna contact pad and a second of the bottom filled vias over the second antenna contact pad;
forming a bottom intermediate layer comprising a bottom intermediate metal layer, a die pad, and a bottom intermediate metal connector over the first antenna contact pad and another bottom intermediate metal connector over the second antenna contact pad;
attaching to the die pad with a top side of an integrated circuit (IC) die comprising a substrate including a semiconductor surface including circuitry having a plurality of bond pads electrically connected to nodes in the circuitry;
the forming the bottom intermediate layer further comprising forming a plurality of metal pillars on the bottom intermediate metal layer including a first pillar on the bottom intermediate metal connector, a second pillar over the bottom intermediate metal connector, a dielectric layer including above the top side of the IC die, and intermediate filled vias through the dielectric layer that reach the bond pads;
forming a top intermediate layer on the bottom intermediate layer including a top intermediate dielectric layer and a top intermediate metal layer comprising a top intermediate metal on the bottom intermediate metal connector and top intermediate metal on the bottom intermediate metal connector, and a first top filled via on the top intermediate metal and a second top filled via on the top intermediate metal;
and
forming a top layer including a top dielectric layer and a top metal layer including a first antenna of a first antenna type on the first top filled via and a second antenna of a second antenna type on the second top filled via.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/232,849Filed 16 Apr 2021 · us provisional application
Priority: 17 Apr 2020
Published: US 2021/0328367 A121 Oct 2021
Granted: 7 Mar 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification18 codes

H01Q 23/00
Antennas with active circuits or circuit elements integrated within them or attached
H01Q 1/2283
By structural association with other equipment or articles: mounted in or on the surface of a semiconductor substrate as a chip-type antenna or…
H01Q 9/0407
Resonant antennas: substantially flat resonant element parallel to ground plane, e.g. patch antenna
H01Q 9/285
Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having…:…