Antenna device and manufacturing method thereof

An antenna device, comprising:

• a substrate;
• a chip disposed on the substrate, wherein the chip has at least two pads;
• an antenna disposed on the substrate, wherein the chip is located between the substrate and the antenna, and the antenna has a first bonding line segment and a second bonding line segment electrically connected to the at least two pads, respectively,
• the first bonding line segment is located at an outermost coil of the antenna and is disposed across a short side direction of the chip in a manner of completely covering one of the at least two pads, and the second bonding line segment is located at an innermost coil of the antenna and is disposed across the short side direction of the chip in a manner of completely covering another of the at least two pads;
• and
• a printed layer located on the substrate,
• the printed layer having an opening, wherein the chip is located in the opening, and a surface of the printed layer and an active surface of the chip are substantially coplanar.

A manufacturing method of an antenna device, comprising:

• a substrate preparation step, forming a substrate;
• a chip placing step, moving the substrate in a roll-to-roll manner, and placing the chip on the substrate, wherein the chip has at least two pads, there is an included angle between a short side direction of the chip and a moving direction of the substrate, and the included angle is less than or equal to 45 degrees;
• and
• an antenna forming step, forming an antenna on the substrate, wherein the chip is located between the substrate and the antenna, and the antenna has a first bonding line segment and a second bonding line segment electrically connected to the at least two pads, respectively,
• the first bonding line segment is located at an outermost coil of the antenna and is disposed across a short side direction of the chip in a manner of completely covering one of the at least two pads, and the second bonding line segment is located at an innermost coil of the antenna and is disposed across the short side direction of the chip in a manner of completely covering another of the at least two pads.