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US 11,600,903 B2Granted
Assembly in place method and apparatus
AssigneeMetawave Corporation
InventorsSoren Shams, Ricky Donald Heckler, Raul Inocencio Alidio, Taha Shahvirdi Dizaj Yekan
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Abstract
In the present invention a guide or carrier is used to assemble and position multiple AiPs (or Integrated Circuit packages) on a substrate and maintain spacing therebetween. In some examples, this reduces package size and maintains desired tolerances. The carrier or guard is to be thin and flexible so as to allow some movement but maintain tolerances at specific locations.
Claims10
A device assembly structure, comprising:
- a substrate structure;
- an integrated circuit (IC) configured on the substrate structure, the IC comprising:
- a first portion having a first dimension, the first dimension contributing a tolerance of the device, and a second dimension contributing to the tolerance of the device;
- and
- a guide structure for generating the first and second dimensions of the first portion,
- wherein the first dimension is a first spacing of the IC on the substrate structure and the second dimension is a second spacing of the IC on the substrate structure.
3 more elements
A method for assembling an Antenna in Package (AiP), comprising:
- positioning a guide on a substrate, the guide having one or more dimensions corresponding to one or more spacings between AiPs, the dimensions creating a tolerance for the AiP;
- and
- placing the AiPs according to the guide.
Dependencies are inferred from the claim text.