Display device

A display device, comprising:

• a substrate;
• an OLED module disposed on a first surface of the substrate;
• and
• a tracing region disposed on a second surface of the substrate opposite to the first surface, the tracing region being electrically connected to the OLED module, wherein the tracing region is disposed at a peripheral edge region of the second surface of the substrate, and a projection of the tracing region on the second surface of the substrate is only at an edge position of a projection of the OLED module on the second surface of the substrate,
• wherein the substrate comprises a via hole disposed in the peripheral edge region of the second surface of the substrate, and a circuit trace in the tracing region is connected to the OLED module via the via hole;
• wherein the display device further comprises a bending region disposed in an intermediate position of two short sides of the substrate and perpendicular to two long sides of the substrate, and the tracing region comprises a first sub-tracing region and a second sub-tracing region disposed at an edge of one long side of the second surface of the substrate and disposed at two sides of the bending region, a third sub-tracing region and a fourth sub-tracing region disposed at an edge of another long side of the second surface of the substrate and disposed at the two sides of the bending region,
• wherein the substrate comprises a first substrate layer and a second substrate layer that are integrally sealed, and at least one of the first substrate layer and the second substrate layer is made of an ultra-thin glass,
• wherein the OLED module comprises a TFT array layer, the first surface of the substrate is a surface of the first substrate layer away from the second substrate layer, and the second surface of the substrate is a surface of the second substrate layer away from the first substrate layer, and
• wherein the display device further comprises a bonding region connected to the OLED module and disposed on the first surface of the substrate, the bonding region comprises a flexible thin film circuit board and a driver IC, and the bonding region is disposed at an edge of the short side of the first surface of the substrate.