Cooler device with aluminum oxide insulators

A solid state cooler device comprising:

• a first normal metal pad;
• a first aluminum layer and a second aluminum layer both disposed on and directly attached to the first normal metal pad and separated from one another by a gap;
• a first aluminum oxide layer formed on and directly attached to the first aluminum layer, and a second aluminum oxide layer formed on and directly attached to the second aluminum layer;
• a first superconductor pad disposed on and directly attached to the first aluminum oxide layer and a second superconductor pad disposed on and directly attached to the second aluminum oxide layer;
• a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad;
• and
• wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.