Semiconductor laser device
AssigneeNichia Corporation
InventorsKazuma Kozuru, Ryota Okuno
Life of this patent
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Abstract
A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.
Claims11
A method of manufacturing a semiconductor device, the method comprising:
- a providing step comprising providing:
- a first member on which at least one semiconductor laser element disposed, and
- a second member including a light-transmissive portion through which light from the at least one semiconductor laser element passes;
- a solder ball forming step comprising forming a plurality of solder balls at intervals on (i) a surface of the first member, or (ii) a surface of the second member facing the surface of the first member;
- a pre-securing step comprising bringing (i) the surface of the second member facing the surface of the first member, or (ii) the first surface of the first member, into contact with an upper surface of the solder balls, which are softened, such that an air passage communicating with the first member is formed between the solder balls;
- and
- a bonding step comprising reducing a pressure in the first member via the air passage, and thereafter, in a state in which a gas for sealing is injected, heating and pressing the second member and the first member, to melt the solder balls and bond the second member and the first member;
- wherein:
- in the pre-securing step, the solder balls are softened at a temperature lower than a melting point of the solder balls;
- and
- in the bonding step, the second member is heated to a temperature equal to or higher than a melting point of the solder balls.
A method of manufacturing a semiconductor device, the method comprising:
- a providing step comprising providing:
- a first member on which at least one semiconductor laser element disposed, and
- a second member including a light-transmissive portion through which light from the at least one semiconductor laser element passes;
- a solder ball forming step comprising forming a plurality of solder balls at intervals on (i) a surface of the first member in which the at least one semiconductor laser element is disposed, or (ii) a surface of the second member facing the surface of the first member;
- and
- a bonding step comprising:
- in a state in which the first member and the second member are separated from each other or integrated with each other such that an air passage is formed between the solder balls, housing the first member and the second member in a container comprising a supply port for supplying a gas for sealing and an exhaust port for exhausting the gas for sealing, and
- while supplying the gas for sealing to the container, heating the first member or the second member provided with the solder balls and pressing the first member and/or the second member, to melt the solder balls and bond the surface of the second member and the surface of the first member to each other.
Dependencies are inferred from the claim text.