Light-emitting device and method of packaging the same
AssigneeLumileds LLC
InventorsHua Sin Yew, Hui Ling Pan, Xinping Yan
Life of this patent
Estimating the term…
Abstract
A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).
Claims19
A light-emitting device comprising:
- a lead frame including a die paddle and a lead spaced apart from each other;
- a light-emitting die attached on the die paddle;
- a wire connecting the light-emitting die to the lead, a first end of the wire and a region of the light-emitting die to which the first end of the wire is bonded forming a first necking area, a second end of the wire and a region of the lead to which the second end of the wire is bonded forming a second necking area;
- a first resin cover covering only the first necking area of the wire and the light-emitting die while leaving a majority of a light emitting area of the light-emitting die free of the first resin cover;
- and
- a second resin cover directly covering the first resin cover, the majority of the light emitting area of the light-emitting die that is free of the first resin cover, and the wire,
- the first resin cover having a hardness lower than a hardness of the second resin cover.
A method for packaging a light-emitting device, the light-emitting device comprising a lead frame and a light-emitting die, the lead frame comprising a die paddle and a lead spaced apart from each other, the light-emitting die being attached on the die paddle, the method comprising:
- connecting the light-emitting die to the lead with a wire, a first end of the wire and a region of the light-emitting die to which the first end of the wire is bonded forming a first necking area, a second end of the wire and a region of the lead to which the second end of the wire is bonded forming a second necking area;
- covering only the first necking area of the wire and the light-emitting die with a first resin cover while leaving a majority of a light emitting area of the light-emitting die free of the first resin cover;
- and
- forming a second resin cover directly on and to seal the first resin cover, the majority of the light emitting area of the light-emitting die that is free of the first resin cover, and the wire,
- the first resin cover having a hardness lower than a hardness of the second resin cover.
Dependencies are inferred from the claim text.