Apparatuses and packages including a semiconductor substrate with a plurality of photoelectronic conversion regions and a transparent substrate
AssigneeSony Group Corporation
InventorsTakaaki Hirano, Shinji Miyazawa, Kensaku Maeda, Yusuke Moriya, Shunsuke Furuse, Yutaka Ooka
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Abstract
Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
Claims20
A package, comprising:
- a semiconductor substrate;
- a color filter layer at a light-incident side of the semiconductor substrate;
- a transparent substrate disposed above a light incident side of the color filter layer;
- a plurality of photoelectric conversion regions located in the semiconductor substrate;
- a microlens layer, wherein the microlens layer is between the color filter layer and the transparent substrate, and wherein the microlens layer includes a plurality of microlenses;
- and
- a resin layer between at least some of the microlenses of the microlens layer and the transparent substrate,
- wherein the photoelectric conversion regions are included in an effective photosensitive region of the package,
- wherein each of the photoelectric conversion regions is associated with one of the microlenses of the microlens layer,
- wherein at least some of the microlenses of the microlens layer are in an effective photosensitive region-surrounding region that is outside of the effective photosensitive region of the package, and
- wherein at least one of the microlenses in the effective photosensitive region-surrounding region has a same size and a same shape as at least one of the microlenses in the effective photosensitive region.
An electronic apparatus, comprising:
- a lens;
- a signal processing circuit;
- and
- a package including:
- a semiconductor substrate;
- a color filter layer at a light-incident side of the semiconductor substrate;
- a transparent substrate disposed above a light incident side of the color filter layer;
- a plurality of photoelectric conversion regions located in the semiconductor substrate;
- a microlens layer, wherein the microlens layer is between the color filter layer and the transparent substrate, and wherein the microlens layer includes a plurality of microlenses;
- and
- a resin layer between at least some of the microlenses of the microlens layer and the transparent substrate,
- wherein the photoelectric conversion regions are included in an effective photosensitive region of the package,
- wherein each of the photoelectric conversion regions is associated with one of the microlenses of the microlens layer,
- wherein at least some of the microlenses of the microlens layer are in an effective photosensitive region-surrounding region that is outside of the effective photosensitive region of the package, and
- wherein at least one of the microlenses in the effective photosensitive region-surrounding region has a same size and a same shape as at least one of the microlenses in the effective photosensitive region.
Dependencies are inferred from the claim text.