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US 11,600,612 B2Granted
Switch chip with bond wires replacing traces in a die
AssigneeVia Labs, Inc.
InventorsDidmin Shih, Tengyi Huang, Ting-Yen Wang, Yen Wei Wu
Life of this patent
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Abstract
A switch chip includes a first switch device, a first ESD protection device and a second ESD protection device. The first switch device is electrically coupled between a first pad and a second pad. The first ESD protection device is electrically coupled to a third pad which is electrically coupled to the first pad by a first bond wire. The second ESD protection device is electrically coupled to a fourth pad which is electrically coupled to the second pad by a second bond wire.
Claims33
A switch chip, comprising:
- a first switch device, electrically coupled between a first pad and a second pad;
- a first ESD protection device, electrically coupled to a third pad, wherein the third pad is electrically coupled to the first pad through a first bond wire;
- and
- a second ESD protection device, electrically coupled to a fourth pad, wherein the fourth pad is electrically coupled to the second pad through a second bond wire.
1 more element
A switch chip, comprising:
- a first switch device, electrically coupled between a first pad and a second pad;
- a second switch device, electrically coupled between the first pad and a third pad;
- a first ESD protection device, electrically coupled to a fourth pad, wherein the fourth pad is electrically coupled to the first pad through a first bond wire;
- a second ESD protection device, electrically coupled to a fifth pad, wherein the fifth pad is electrically coupled to the second pad through a second bond wire;
- and
- a third ESD protection device, electrically coupled to a sixth pad, wherein the sixth pad is electrically coupled to the third pad through a third bond wire.
3 more elements
A switch chip, comprising:
- a first switch device, electrically coupled between a first pad and a second pad;
- a second switch device, electrically coupled between the second pad and a third pad;
- a third switch device, electrically coupled between a fourth pad and a fifth pad;
- a fourth switch device, electrically coupled between the fifth pad and a sixth pad;
- a fifth switch device, electrically coupled between a seventh pad and an eighth pad;
- a sixth switch device, electrically coupled between the eighth pad and a ninth pad;
- a first ESD protection device, electrically coupled to a tenth pad, wherein the tenth pad is electrically coupled to the first pad through a first bond wire, and electrically coupled to the fourth pad through a second bond wire, and electrically coupled to the seventh pad through a third bond wire;
- a second ESD protection device, electrically coupled to an eleventh pad, wherein the eleventh pad is electrically coupled to the third pad through a fourth bond wire, electrically coupled to the sixth pad through a fifth bond wire, and electrically coupled to the ninth pad through a sixth bond wire;
- a third ESD protection device, electrically coupled to a twelfth pad, wherein the twelfth pad is electrically coupled to the second pad through a seventh bond wire;
- a fourth ESD protection device, electrically coupled to a thirteenth pad, wherein the thirteenth pad is electrically coupled to the fifth pad through an eighth bond wire;
- and
- a fifth ESD protection device, electrically coupled to a fourteenth pad, wherein the fourteenth pad is electrically coupled to the eighth pad through a ninth bond wire.
9 more elements
A switch chip, comprising:
- a first pin, electrically coupled to a first pad through a first bond wire;
- a second pin, electrically coupled to a second pad through a second bond wire;
- and
- a die, comprising a first switch device, wherein a terminal of the first switch device is electrically coupled to the first pad through a third bond wire, and another terminal of the first switch device is electrically coupled to the second pad through a fourth bond wire.
1 more element
A switch chip, comprising:
- a first pin, electrically coupled a first pad through a first bond wire;
- a second pin, electrically coupled to a second pad through a second bond wire;
- a third pin, electrically coupled to a third pad through a third bond wire;
- and
- a die, comprising:
- a first switch device, wherein a terminal of the first switch device is electrically coupled to the second pad through a fourth bond wire;
- and
- a second switch device, wherein a terminal of the second switch device is electrically coupled to the third pad through a fifth bond wire, and another terminal of the first switch device and another terminal of the second switch device both are electrically coupled to the first pad through a sixth bond wire.
5 more elements
A switch chip, comprising:
- a first pin, electrically coupled to a first pad through a first bond wire;
- a second pin, electrically coupled to a second pad through a second bond wire;
- a third pin, electrically coupled to a third pad through a third bond wire;
- a fourth pin, electrically coupled to a fourth pad through a fourth bond wire;
- a fifth pin, electrically coupled to a fifth pad through a fifth bond wire;
- and
- a die, comprising:
- a first switch device, wherein a terminal of the first switch device is electrically coupled to the first pad through a sixth bond wire;
- a second switch device, wherein a terminal of the second switch device is electrically coupled to the second pad through a seventh bond wire, and another terminal of the first switch device and another terminal of the second switch device both are electrically coupled to the third pad through an eighth bond wire;
- a third switch device, wherein a terminal of the third switch device is electrically coupled to the first pad through a ninth bond wire;
- a fourth switch device, wherein a terminal of the fourth switch device is electrically coupled to the second pad through a tenth bond wire, and another terminal of the third switch device and another terminal of the fourth switch device both are electrically coupled to the fourth pad through an eleventh bond wire;
- a fifth switch device, wherein a terminal of the fifth switch device is electrically coupled to the first pad through a twelfth bond wire;
- and
- a sixth switch device, wherein a terminal of the sixth switch device is electrically coupled to the second pad through a thirteenth bond wire, and another terminal of the fifth switch device and another terminal of the sixth switch device both are electrically coupled to the fifth pad through a fourteenth bond wire.
11 more elements
Dependencies are inferred from the claim text.