Semiconductor module including multiple power management semiconductor packages
AssigneeSamsung Electronics Co., Ltd.
InventorHeungkyu Kwon
Life of this patent
Estimating the term…
Abstract
A semiconductor module may include a system board including a top surface and a bottom surface, a module substrate provided on the top surface of the system board, a system semiconductor package mounted on the module substrate, and first and second power management semiconductor packages mounted on the module substrate. The first and second power management semiconductor packages may be spaced apart from each other in a first direction, which is parallel to a top surface of the module substrate, with the system semiconductor package interposed therebetween.
Claims20
A semiconductor module, comprising:
- a system board including a top surface and a bottom surface;
- a module substrate on the top surface of the system board;
- a system semiconductor package on the module substrate;
- and
- a pair of power management semiconductor packages on the module substrate, the pair of power management semiconductor packages configured to power the system semiconductor package, the pair of power management semiconductor packages including a first power management semiconductor package and a second power management semiconductor package spaced apart from the first power management semiconductor package in a first direction with the system semiconductor package therebetween, the first direction being parallel to a top surface of the module substrate.
A semiconductor module, comprising:
- a system board;
- a system semiconductor package on the system board, the system semiconductor package including a system-on-chip;
- a pair of power management semiconductor packages on the system board, the pair of power management semiconductor packages configured to power the system semiconductor package, the pair of power management semiconductor packages including a first power management semiconductor package and a second power management semiconductor package;
- first wires disposed across a first side surface of the system semiconductor package, when viewed in a plan view, the first power management semiconductor package being electrically connected to the system semiconductor package via the first wires;
- and
- second wires disposed across a second side surface of the system semiconductor package, the second power management semiconductor package being electrically connected to the system semiconductor package via the second wires, the second side surface being opposite to the first side surface, wherein
- the first wires and the second wires extend in different directions from the system semiconductor package.
A semiconductor module, comprising:
- a system board;
- a module substrate on the system board;
- a pair of power management semiconductor packages on a top surface of the module substrate, the pair of power management semiconductor packages being spaced apart in a first direction parallel to the top surface of the module substrate;
- an interposer between the pair of power management semiconductor packages;
- and
- a system-on-chip and a memory chip stack on the interposer, the system-on-chip being between the pair of power management semiconductor packages, when viewed in a plan view, the system-on-chip being powered via the pair of power management semiconductor packages.
Dependencies are inferred from the claim text.