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US 11,600,599 B2Granted
Stack packages including supporter
AssigneeSK hynix Inc.
InventorTae Hoon Kim
Life of this patent
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Abstract
A stack package is disclosed. A first semiconductor die and a supporter are disposed on a package substrate. The supporter may include a second side facing a first side of the first semiconductor die having a substantially inclined surface. A second semiconductor die is stacked on the first semiconductor die and on the supporter. An encapsulant layer is formed to fill a portion between the supporter and the first semiconductor die.
Claims11
A stack package comprising:
- a first semiconductor die disposed over a package substrate;
- a supporter disposed over the package substrate and having a second side facing a first side of the first semiconductor die, the second side having a substantially inclined surface;
- a second semiconductor die stacked over the first semiconductor die and over the supporter;
- and
- an encapsulant layer filling a portion between the supporter and the first semiconductor die,
- wherein the inclined surface is a side extending along a direction between an X-axis and a Y-axis in an X-Y plane;
- and
- wherein the first side of the first semiconductor die extends along the X-axis.
5 more elements
Dependencies are inferred from the claim text.