Semiconductor package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Cheng Hsu, Shin-Puu Jeng
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Abstract
The present disclosure provides a semiconductor package, including a substrate, a semiconductor die, and a conductive bump. The substrate has a first surface and a second surface opposite to the first surface. The substrate further includes a conductive line surrounded by a dielectric, and a conductive via connected to the conductive line and protruding from the dielectric at the second surface. The semiconductor die is connected to the first surface of the substrate. The conductive bump is connected to the conductive via at the second surface.
Claims19
A semiconductor package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface, the substrate comprising:
- a conductive line surrounded by a dielectric;
- and
- a conductive via connected to the conductive line and protruding from the dielectric at the second surface;
- a semiconductor die connected to the first surface of the substrate;
- and
- a conductive bump connected to the conductive via at the second surface;
- wherein the conductive via comprises a wider end connecting with the conductive line and a narrower end connecting with the conductive bump.
A semiconductor package, comprising:
- a redistribution layer (RDL) substrate having a first surface and a second surface opposite to the first surface, and having a conductive via protruding from the second surface;
- a semiconductor die bonded to the first surface;
- a first conductive pattern layer on the second surface, wherein a portion of the first conductive pattern layer covers a portion of the conductive via protruding from the second surface;
- and
- a second conductive pattern layer covers the portion of the first conductive pattern layer.
A semiconductor package, comprising:
- a redistribution layer (RDL) substrate having a first surface and a second surface opposite to the first surface;
- a semiconductor die bonded to the first surface;
- and
- a conductive pattern layer on the second surface, the conductive pattern layer having a copper pillar and a copper pad electrically isolated from the copper pillar.
Dependencies are inferred from the claim text.