Die bonding apparatus and method and substrate bonding apparatus and method

A die bonding apparatus for bonding a die to a substrate, the die bonding apparatus comprising:

• a chuck configured to support the die;
• a bonding stage configured to support the substrate;
• a ground plate with vacuum suction provided between the chuck and the bonding stage so as to be movable and configured to pick up the die and transfer the die to a bonding area on the substrate;
• an atmospheric plasma device configured to hydrophilize a bonding surface of the die that is to be bonded to the substrate, by plasma processing;
• a piezoelectric liquid jetting head configured to form a liquid film on the bonding area of the substrate that is to be bonded with the die, by supplying a liquid including water to the bonding area of the substrate;
• and
• a transfer device configured to move the atmospheric plasma device along a transfer direction of the die;
• wherein the atmospheric plasma device includes hydrophilic radicals,
• the hydrophilic radicals include hydrogen or hydroxyl radicals, and
• wherein the transfer device moves the atmospheric plasma device at a speed lower than a transfer speed of the die while the die is moved in a plasma processing interval.