Package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTian Hu, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao
Life of this patent
Estimating the term…
Abstract
A package includes a die and a redistribution layer. A top surface of the die has a first area and a second area connected with the first area. The redistribution layer structure includes a first insulation layer, a redistribution layer, and a second insulation layer. The first insulation layer is overlapping with the second area. The redistribution layer is disposed above the die. The second insulation layer is disposed above the redistribution layer and overlapping with the second area and the first area. The second insulation layer covers a top surface of the first insulation layer and is in contact with a side surface of the first insulation layer and the top surface of the die.
Claims20
A package, comprising:
- a die, wherein a top surface of the die has a first area and a second area connected with the first area;
- and
- a redistribution layer structure comprising:
- a first insulation layer overlapping with the second area;
- a redistribution layer disposing above the die;
- and
- a second insulation layer disposing above the redistribution layer and overlapping with the second area and the first area, wherein the second insulation layer covers a top surface of the first insulation layer and is in contact with a side surface of the first insulation layer and the top surface of the die.
A package, comprising:
- a die, wherein a top surface of the die has a first area and a second area connected with the first area;
- and
- a redistribution layer structure comprising:
- a first insulation layer overlapping with the second area;
- a second insulation layer disposing above the first insulation layer and the die, wherein the second insulation layer covers and is in contact with a boundary between a side surface of the first insulation layer and the top surface of the die, wherein a cohesion between the second insulation layer and the top surface of the die is stronger than a cohesion between the first insulation layer and the top surface of the die;
- and
- a redistribution layer disposing above the die.
A package, comprising:
- a die, wherein a top surface of the die has a first area and a second area surrounding the first area;
- and
- a redistribution layer structure comprising:
- a first insulation layer disposing above the second area and surrounding the first area;
- a redistribution layer disposing above the first insulation layer;
- a second insulation layer disposing above the redistribution layer and overlapping with the second area, wherein the second insulation layer covers and is in contact with a boundary between a side surface of the first insulation layer and the top surface of the die;
- and
- a third insulation layer disposing between the first insulation layer and the second insulation layer and between the redistribution layer and the second insulation layer, wherein the second insulation layer covers and is in contact with a boundary between a side surface of the third insulation layer and a top surface of the first insulation layer.
Dependencies are inferred from the claim text.