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US 11,600,590 B2Granted
Semiconductor device and semiconductor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWei-Wei Liu, Huei-Siang Wong
Life of this patent
Estimating the term…
Abstract
A semiconductor device and a semiconductor package including the same are provided. The semiconductor device includes a semiconductor element; a protective layer disposed adjacent to the surface of the semiconductor element, the protective layer defining an opening to expose the semiconductor element; a first bump disposed on the semiconductor element; and a second bump disposed onto the surface of the protective layer. The first bump has a larger cross-section surface area than the second bump.
Claims17
A semiconductor device, comprising:
- a substrate comprising a pad disposed on a surface of the substrate;
- a first protective layer disposed over the surface of the substrate, the first protective layer comprising an opening to expose the pad;
- a second protective layer disposed between the first protective layer and the substrate, wherein the second protective layer comprises a top surface comprising an upper portion and a lower portion neither level with nor contacting the upper portion, wherein the first protective layer is disposed on the lower portion of the second protective layer and not on the upper portion of the second protective layer;
- a first bump comprising a first pillar disposed on the pad and a first reflowable material on the first pillar;
- and
- a second bump disposed outside the opening and comprising a second pillar disposed on the first protective layer, and comprising a second reflowable material on the second pillar,
- wherein an elevation of a top surface of the first pillar is lower than an elevation of a top surface of the second pillar, and
- wherein a thickness of the first reflowable material is greater than a thickness of the second reflowable material.
5 more elements
A semiconductor device comprising:
- a first substrate comprising a first pad disposed on a surface of the first substrate;
- a first protective layer disposed over the surface of the first substrate, the first protective layer comprising an opening to expose the first pad
- a first bump disposed on the first pad;
- a second bump disposed on the first protective layer and outside the opening;
- a second substrate disposed over the first substrate;
- and
- a first conductive via disposed in the second substrate electrically connected to the second pad, and a second conductive via disposed in the second substrate connected to the third pad, wherein a width of a cross-section of the second conductive via is smaller than a width of the cross-section of the first conductive via from a top view perspective,
- wherein the first bump is configured to electrically connect the first substrate to the second substrate and wherein the second bump is configured to dissipate heat from the first substrate and to the second substrate, and
- wherein the second substrate comprises a second pad electrically connecting to the first bump and comprises a third pad connected to the second bump, and wherein the third pad is configured to dissipate heat from the second bump.
6 more elements
Dependencies are inferred from the claim text.