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US 11,600,588 B1Granted
Superconducting bump bonds for quantum computing systems
AssigneeGoogle Inc.
InventorsZhimin Jamie Yao, Bob Benjamin Buckley
Life of this patent
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Abstract
A quantum computing system can include a first substrate including one or more quantum control devices. The quantum computing system can include a second substrate including one or more quantum circuit elements. The quantum computing system can include one or more tin contact bonds formed on the first substrate and the second substrate. The tin contact bonds can bond the first substrate to the second substrate. The tin contact bonds can be or can include tin, such as a tin alloy.
Claims7
A quantum computing system comprising:
- a first substrate comprising one or more quantum control devices;
- a second substrate comprising one or more quantum circuit elements;
- and
- one or more tin contact bonds formed on the first substrate and the second substrate,
- wherein the one or more tin contact bonds are coated with a capping layer.
2 more elements
Dependencies are inferred from the claim text.