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US 11,600,587 B2Granted
Pad design for reliability enhancement in packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsien-Wei Chen
Life of this patent
Estimating the term…
Abstract
A package includes a corner, a device die, a molding material molding the device die therein, and a plurality of bonding features. The plurality of bonding features includes a corner bonding feature at the corner, wherein the corner bonding feature is elongated. The plurality of bonding features further includes an additional bonding feature, which is non-elongated.
Claims19
A method comprising:
- forming a first package comprising:
- a device die;
- a first through-via and a second through-via, wherein the first through-via has an elongated top-view shape, and the second through-via has a non-elongated top-view shape;
- and
- a molding material molding the device die, the first through-via, and the second through-via therein;
- etching a dielectric material of the first package to expose surfaces of the first through-via and the second through-via;
- and
- forming a first solder region and a second solder region contacting the surfaces of the first through-via and the second through-via, wherein the first solder region and the second solder region contact sidewalls of the first through-via and the second through-via, respectively, to form interfaces that are in physical contact with a surface of the molding material.
5 more elements
A method comprising:
- forming a plurality of metal posts, wherein the plurality of metal posts comprise a first metal post and a second metal post, wherein the first metal post is elongated, and the second metal post is non-elongated, and wherein the first metal post and the second metal post have a same top-view area;
- encapsulating the plurality of metal posts in an encapsulant;
- recessing the encapsulant to reveal sidewalls of the plurality of metal posts;
- forming a first solder region contacting a first top surface and first sidewalls of the first metal post;
- and
- forming a second solder region contacting a second top surface and second sidewalls of the second metal post.
3 more elements
A method comprising:
- forming a first package comprising:
- a device die;
- a first through-via and a second through-via, wherein the first through-via has an elongated top-view shape, and the second through-via has a non-elongated top-view shape;
- and
- a molding material molding the device die, the first through-via, and the second through-via therein;
- etching a dielectric material of the first package to expose surfaces of the first through-via and the second through-via;
- forming a first solder region and a second solder region contacting the surfaces of the first through-via and the second through-via;
- and
- bonding a second package to the first package, wherein an elongate metal pad in the second package is bonded to the first through-via that has the elongated top-view shape, and a non-elongate metal pad in the second package is bonded to the second through-via that has the non-elongated top-view shape.
6 more elements
Dependencies are inferred from the claim text.