Semiconductor device with metal plugs and method for manufacturing the same
AssigneeKioxia Corporation
InventorMitsunari Horiuchi
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Abstract
A semiconductor device includes a first substrate, a first insulating film provided on the first substrate, and a first plug provided in the first insulating film. The device further includes a first layer provided on the first insulating film and a first metal layer provided on the first plug in the first layer and electrically connected to the first plug. The device further includes a second metal layer including a first portion provided in the first layer and a second portion provided on the first layer and electrically connected to the first metal layer.
Claims20
A semiconductor device comprising:
- a first substrate;
- a first insulating film disposed on the first substrate;
- a first plug disposed in the first insulating film;
- a first layer disposed on the first insulating film;
- a first metal layer provided above the first plug being in contact with the first plug, and wherein the first metal layer is formed in the first layer;
- and
- a second metal layer including (i) a first portion provided in the first layer and (ii)
- a second portion disposed on the first layer and electrically connected to the first metal layer.
A semiconductor device comprising:
- a first insulating film;
- a first plug disposed in the first insulating film;
- a substrate disposed on the first insulating film;
- a first metal layer disposed on and electrically connected to the first plug, and wherein the first metal layer is formed in the substrate;
- and
- a second metal layer including (i) a first portion provided in the substrate and (ii) a second portion disposed on the substrate and electrically connected to the first metal layer,
- wherein the first plug is made of a first metal material, and
- the first metal layer is made of a second metal material different from the first metal material.
A method of manufacturing a semiconductor device comprising:
- providing a first substrate and a second substrate;
- forming a first metal layer in the second substrate;
- forming a first plug on the first metal layer;
- adhering the first substrate to the second substrate via the first plug and the first metal layer;
- forming a first opening in the second substrate to expose the first metal layer;
- and
- forming a second metal layer in the first opening, the second metal layer being electrically connected to the first plug.
Dependencies are inferred from the claim text.