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US 11,600,584 B2Granted
Chip, circuit board and electronic device
AssigneeBeijing Xiaomi Mobile Software Co., Ltd.
InventorsJinfu Zhang, Yunjun Hua
Life of this patent
Estimating the term…
Abstract
A chip includes: a chip substrate including a central area and an edge area surrounding the central area; and a plurality of pads arranged on the chip substrate, the plurality of pads including a first pad and a second pad, wherein the first pad is arranged in the edge area and includes at least one straight side adjacent to a side of the chip substrate, and the second pad is arranged in the central area.
Claims18
A chip, comprising:
- a chip substrate comprising a central area and an edge area surrounding the central area;
- and
- a plurality of pads arranged on the chip substrate, the plurality of pads comprising a first pad and a second pad,
- wherein the first pad is arranged in the edge area and comprises at least one straight side adjacent to a side of the chip substrate, and
- the second pad is arranged in the central area;
- wherein the edge area comprises:
- a straight edge sub-area;
- and a corner edge sub-area connecting two adjacent straight edge sub-areas,
- wherein the first pad in the straight edge sub-area comprises a rectangular soldering area and an arcuate soldering area connected to the rectangular soldering area, and the rectangular soldering area is arranged between the arcuate soldering area and the side of the chip substrate,
- wherein the first pad in the corner edge sub-area comprises one of:
- a pentagonal soldering area and an arcuate soldering area connected to the pentagonal soldering area;
- or
- a triangular soldering area and an arcuate soldering area connected to the triangular soldering area.
10 more elements
A circuit board, comprising:
- a circuit board substrate comprising a central area and an edge area surrounding the central area;
- and
- a plurality of pads arranged on the circuit board substrate, the plurality of pads comprising a first pad and a second pad,
- wherein the first pad is arranged in the edge area and comprises at least one straight side adjacent to a side of the circuit board substrate, and
- the second pad is arranged in the central area;
- wherein the edge area comprises:
- a straight edge sub-area, and a corner edge sub-area connecting two adjacent straight edge sub-areas,
- wherein the first pad in the straight edge sub-area comprises a rectangular soldering area and an arcuate soldering area connected to the rectangular soldering area, and the rectangular soldering area is arranged between the arcuate soldering area and the side of the chip substrate,
- wherein the first pad in the corner edge sub-area comprises one of:
- a pentagonal soldering area and an arcuate soldering area connected to the pentagonal soldering area;
- or
- a triangular soldering area and an arcuate soldering area connected to the triangular soldering area.
9 more elements
An electronic device, comprising:
- a chip;
- and
- a circuit board,
- wherein the chip comprises:
- a chip substrate comprising a central area and an edge area surrounding the central area;
- and
- a first plurality of pads arranged on the chip substrate, the first plurality of pads comprising a first pad and a second pad, wherein the first pad is arranged in the edge area and comprises at least one straight side adjacent to a side of the chip substrate, and the second pad is arranged in the central area;
- and
- wherein the circuit board comprises:
- a circuit board substrate comprising a central area and an edge area surrounding the central area;
- and
- a second plurality of pads arranged on the circuit board substrate, the second plurality of pads comprising a third pad and a fourth pad, wherein the third pad is arranged in the edge area and comprises at least one straight side adjacent to a side of the circuit board substrate, and the fourth pad is arranged in the central area,
- wherein the edge area of the chip comprises:
- a straight edge sub-area;
- and a corner edge sub-area connecting two adjacent straight edge sub-areas,
- wherein the first pad in the straight edge sub-area comprises a rectangular soldering area and an arcuate soldering area connected to the rectangular soldering area, and the rectangular soldering area is arranged between the arcuate soldering area and the side of the chip substrate,
- wherein the first pad in the corner edge sub-area comprises one of:
- a pentagonal soldering area and an arcuate soldering area connected to the pentagonal soldering area;
- or
- a triangular soldering area and an arcuate soldering area connected to the triangular soldering area, and
- wherein the edge area of the circuit board comprises:
- a straight edge sub-area, and a corner edge sub-area connecting two adjacent straight edge sub-areas,
- wherein the third pad in the straight edge sub-area comprises a rectangular soldering area and an arcuate soldering area connected to the rectangular soldering area, and the rectangular soldering area is arranged between the arcuate soldering area and the side of the chip substrate,
- wherein the third pad in the corner edge sub-area comprises one of:
- a pentagonal soldering area and an arcuate soldering area connected to the pentagonal soldering area;
- or
- a triangular soldering area and an arcuate soldering area connected to the triangular soldering area.
24 more elements
Dependencies are inferred from the claim text.