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US 11,600,583 B2Granted
Textured bond pads
AssigneeTexas Instruments Incorporated
InventorsRafael Jose Lizares Guevara, Aniceto Tabangcura Rabilas, Jr., Ray Fredric Solis de Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya
Life of this patent
Estimating the term…
Abstract
In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
Claims30
A method of fabricating a semiconductor device, comprising:
- providing a semiconductor substrate;
- forming a bond pad on the semiconductor substrate, wherein forming the bond pad includes:
- positioning a metal layer on the semiconductor substrate;
- and
- chemically etching a top surface of the metal layer to form a textured top surface;
- providing a metal contact of a leadframe;
- using a bond wire to form an electrical pathway between the metal contact and the textured top surface of the metal layer;
- and
- encapsulating the semiconductor substrate, the bond pad, the bond wire, and at least a portion of the metal contact in a protective housing.
6 more elements
A method of fabricating a semiconductor device, comprising:
- providing a semiconductor substrate;
- forming a bond pad on the semiconductor substrate, wherein forming the bond pad includes:
- providing a stack of metal layers on the semiconductor substrate;
- and
- forming a protrusion on a top surface of the stack of metal layers;
- providing a metal contact of a leadframe;
- using a bond wire to form an electrical pathway between the metal contact and the protrusion;
- and
- encapsulating the semiconductor substrate, the bond pad, the bond wire, and at least a portion of the metal contact in a protective housing.
6 more elements
A method of making a semiconductor device, comprising:
- forming a bond pad on a semiconductor die, the bond pad having a protrusion on a top surface of the bond pad;
- providing a metal contact;
- and
- coupling a bond wire to the protrusion and to the metal contact.
1 more element
Dependencies are inferred from the claim text.