Packaged electronic device and multilevel lead frame coupler

A multilayer lead frame, comprising:

• opposite first and second sides;
• a first trace level having first patterned conductive features;
• a second trace level having second patterned conductive features;
• a via level between the first trace level and the second trace level, the via level including conductive vias that interconnect respective ones of the first and second patterned conductive features;
• a conductive feed structure;
• and
• a conductive reflector wall;
• the first trace level including a conductive coupler antenna and a conductive ground structure that extends along the first side in a plane of a first direction and a second direction, the first direction orthogonal to the second direction, the conductive coupler antenna having a portion thereof that faces outward from the first side along a third direction, the third direction orthogonal to the first direction and the second direction;
• the conductive reflector wall having an opening, the conductive reflector wall extending along the third direction between the first trace level and the second trace level, the conductive reflector wall extending around a portion of the conductive coupler antenna;
• and
• the conductive feed structure coupled to the conductive coupler antenna, the conductive feed structure extending along the first direction through the opening of the conductive reflector wall.

A method of fabricating a packaged electronic device, the method comprising:

• forming a first trace level of a multilayer lead frame, the first trace level having first patterned conductive features and an insulator portion between the first patterned conductive features, the first patterned conductive features including a conductive coupler antenna and a conductive ground structure that extends in a plane of a first direction and a second direction, the first direction orthogonal to the second direction, the conductive coupler antenna having a portion thereof that faces outward from a first side of the multilayer lead frame along a third direction, the third direction orthogonal to the first direction and the second direction;
• forming a via level of the multilayer lead frame on the first trace level, the via level having conductive vias and another insulator portion between the conductive vias;
• forming a second trace level of the multilayer lead frame on the via level, the second trace level having second patterned conductive features and a further insulator portion between the second patterned conductive features;
• forming a conductive feed structure in one of the first trace level and the via level of the multilayer lead frame, the conductive feed structure coupled to the conductive coupler antenna, the conductive feed structure extending along the first direction;
• and
• forming a conductive reflector wall having an opening, the conductive reflector wall extending along the third direction between the first trace level and the second trace level, the conductive reflector wall extending around a portion of the conductive coupler antenna, and the conductive feed structure extending along the first direction through the opening of the conductive reflector wall.