Display panel, array substrate, display device and method for fabricating array substrate
AssigneeBoe Technology Group Co., Ltd.
InventorChengyuan Luo
Life of this patent
Estimating the term…
Abstract
The disclosure relates to an array substrate and a method for fabricating an array substrate. The array substrate includes a base substrate, a cover layer on the base substrate, an opening at least partially passing through the cover layer, a stress buffer structure adjacent to the opening and on a side of the cover layer facing the base substrate, wherein the stress buffer structure includes a phase change material, wherein a height of a portion of the cover layer on the phase change material is lower than a height of a portion of the cover layer adjacent to the phase change material.
Claims14
An array substrate comprising:
- a base substrate;
- a cover layer on the base substrate;
- an opening completely passing through the cover layer;
- a stress buffer structure adjacent to the opening and on a side of the cover layer facing the base substrate and configured to protect the cover layer from cracking when forming the opening, wherein the stress buffer structure comprises a phase change material, wherein a height of a portion of the cover layer on the phase change material is lower than a height of a portion of the cover layer adjacent to the phase change material, and wherein the phase change material comprises a solid-liquid phase change material,
- wherein before the opening is formed, the phase change material is in a solid state;
- and wherein when forming the opening, the phase change material is changed from the solid state to a liquid state;
- a groove in the base substrate, wherein the phase change material is disposed in the groove, and wherein a top surface of the phase change material is lower than a top surface of the base substrate,
- wherein the cover layer comprises a passivation layer and a packaging layer disposed on a side of the passivation layer.
A method for fabricating an array substrate comprising:
- forming a stress buffer structure in a region of a base substrate adjacent to a region to be opened and configured to protect a cover layer to be formed on the base substrate from cracking when forming an opening completely passing through the cover layer in the region to be opened, wherein the stress buffer structure comprises a phase change material, wherein forming the stress buffer structure comprises forming a groove in a region of the base substrate adjacent to the region to be opened, and forming the phase change material in the groove, and wherein a top surface of the phase change material is lower than a top surface of the base substrate;
- forming the cover layer on the region to be opened and on the stress buffer structure, wherein a height of a portion of the cover layer on the phase change material is lower than a height of a portion of the cover layer adjacent to the phase change material;
- performing a first phase change treatment on the phase change material to change the phase change material from a solid state to a liquid state;
- removing a portion of the cover layer in the region to be opened to form the opening;
- and
- performing a second phase change treatment on the phase change material to change the phase change material from the liquid state to the solid state.
Dependencies are inferred from the claim text.