Method for forming chip package structure

A method for forming a chip package structure, comprising:

• forming a conductive pad over a carrier substrate;
• forming a substrate layer over the carrier substrate;
• forming a conductive pillar in the substrate layer;
• forming a recess in the substrate layer;
• disposing a chip in the recess;
• forming a molding layer surrounding the chip;
• and
• forming a redistribution structure over the substrate layer, wherein the redistribution structure is electrically connected to the chip and the conductive pad.

A method for forming a chip package structure, comprising:

• forming a solder resist layer on a carrier substrate;
• forming a conductive pad over the solder resist layer;
• forming a substrate layer over the carrier substrate and surrounding the conductive pad;
• forming a conductive pillar above the conductive pad, wherein the conductive pillar is exposed from a top surface of the substrate layer;
• removing a portion of the substrate layer to dispose a chip in the substrate layer;
• forming a molding layer to cover the chip;
• and
• forming a redistribution structure over the molding layer to electrically connect the chip and the conductive pillar.