Structure and formation method of chip package with conductive support elements to reduce warpage

A method for forming a package structure, comprising:

• placing a semiconductor die over a redistribution structure;
• placing a conductive feature over an interposer substrate, wherein the conductive feature comprises a support element and a solder element, the support element comprises a metal material, and the solder element extends along a top surface, a bottom surface, and sidewall surfaces of the support element;
• stacking the interposer substrate over the redistribution structure such that the conductive feature is electrically connected to a conductive element of the redistribution structure;
• forming a protective layer to surround the conductive feature and the semiconductor die;
• forming an adhesive element over the semiconductor die before the interposer substrate is stacked;
• and
• forming a thermal conductive element over the interposer substrate before the interposer substrate is stacked, wherein the thermal conductive element penetrates the adhesive element after the interposer substrate is stacked.

A method for forming a package structure, comprising:

• placing a semiconductor die over a redistribution structure;
• forming an adhesive element over the semiconductor die;
• forming a thermal conductive element over an interposer substrate;
• stacking the interposer substrate over the redistribution structure such that the thermal conductive element extends into the adhesive element;
• and
• forming a protective layer to surround the semiconductor die.