Routing structure between dies and method for arranging routing between dies

A method for arranging routing structure between dies, comprising:

• disposing a trace layer on a substrate, wherein a plurality of routing paths is embedded in the trace layer;
• and
• disposing a first die and a second die on the trace layer as connected by the routing paths,
• wherein a spacing gap between the first die and the second die is along a first direction and interfacing edges of the first die and the second die are extending along a second direction perpendicular to the first direction,
• wherein each of the routing paths has a corresponding wire length along a connection direction from the first die to the second die,
• wherein each of the routing paths has a corresponding wire width perpendicular to the connection direction,
• wherein each of the routing paths connects between the interfacing edges of the first die and the second die, and includes a first straight portion, a second straight portion and a third straight portion in sequence, and is equal in the wire width and the wire length, wherein the first straight portion and the third straight portion are extending along the first direction,
• wherein each of the second straight portions has a first slant angle with respect to the first direction other than 0° and 90°,
• wherein joining interfaces between the first straight portion and the second straight portion and between the second straight portion and the third straight portion have an included angle from the second direction to maintain the wire width being equal,
• wherein each of the joining interfaces is located at a central line of an angle included between the first straight portion and the second straight portion.