Semiconductor device package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChih-Cheng Lee, Kuang Hsiung Chen
Life of this patent
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Abstract
A semiconductor device package includes a first circuit layer, a second circuit layer, a first semiconductor die and a second semiconductor die. The first circuit layer includes a first surface and a second surface opposite to the first surface. The second circuit layer is disposed on the first surface of the first circuit layer. The first semiconductor die is disposed on the first circuit layer and the second circuit layer, and electrically connected to the first circuit layer and the second circuit layer. The second semiconductor die is disposed on the second circuit layer, and electrically connected to the second circuit layer.
Claims13
A semiconductor device package, comprising:
- a first redistribution layer (RDL) including a top surface;
- a second RDL including a top surface, a bottom surface opposite to the top surface, a conductive wiring and a metal layer, wherein the conductive wiring is closer to the top surface than the bottom surface is, and the metal layer is closer to the bottom surface than the top surface is;
- a first semiconductor component disposed over the top surface of the first RDL and over the top surface of the second RDL;
- a second semiconductor component disposed over the top surface of the first RDL and over the top surface of the second RDL, and electrically connected to the first semiconductor component through the conductive wiring of the second RDL, wherein in a cross-sectional view, a lateral surface of the metal layer is substantially aligned with a lateral surface of the second RDL;
- and
- an encapsulant contacting the lateral surface of the metal layer and an inner sidewall of the first RDL,
- wherein the top surface of the second RDL is lower than the top surface of the first RDL, and wherein the first RDL further includes a first inner via tapering toward the bottom surface of the first RDL.
A semiconductor device package, comprising:
- a first redistribution layer (RDL) having a top surface, defining a recess recessed from the top surface, and including:
- a first dielectric layer having a first inner side surface;
- and
- a second dielectric layer disposed over the first dielectric layer, and having a second inner side surface;
- wherein both the first inner side surface and the second inner side surface partially define the recess;
- wherein in a cross-sectional view, both the first inner side surface and the second inner side surface include curved surfaces.
Dependencies are inferred from the claim text.