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US 11,600,563 B2Granted
Molded embedded bridge including routing layers for enhanced EMIB applications
AssigneeIntel Corporation
InventorsSrinivas Venkata Ramanuja Pietambaram, Rahul N. Manepalli
Life of this patent
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Abstract
Disclosed is an embedded multi-die interconnect bridge (EMIB) substrate. The EMIB substrate can comprise an organic substrate, a bridge embedded in the organic substrate and a plurality of routing layers. The plurality of routing layers can be embedded within the bridge. Each routing layer can have a plurality of traces. Each of the plurality of routing layers can have a coefficient of thermal expansion (CTE) that varies from an adjacent routing layer.
Claims19
A device comprising:
- a substrate;
- and
- a bridge embedded in the substrate, the bridge including a plurality of routing layers, each routing layer having a plurality of traces,
- wherein a first routing layer of the plurality of routing layers has a first silica filler content and a second routing layer of the plurality of routing layers has a second silica filler content, the second silica filler content different than the first silica filler content,
- wherein the first routing layer and the second routing layer are made of the same material.
2 more elements
A device comprising:
- a substrate;
- and
- a bridge including a plurality of routing layers, the bridge at least partially embedded in the substrate,
- wherein each of the plurality of routing layers is made of the same material and includes:
- a plurality of traces, and
- a silica filler content that differs from the silica filler content of an adjacent routing layer.
3 more elements
A device comprising:
- a substrate having a coefficient of thermal expansion;
- a bridge including a plurality of routing layers made of the same material, the bridge at least partially embedded in the substrate, each of the plurality of routing layers including a plurality of traces and a silica filler content, the silica filler content of each of the plurality of routing layers differing from the silica filler content of an adjacent routing layer;
- and
- a mold that encapsulates at least a majority of the bridge.
1 more element
Dependencies are inferred from the claim text.