Semiconductor packages and method of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Jung Tseng, Fu-Jen Li
Life of this patent
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Abstract
A semiconductor package includes an interposer, a die, a protective layer, a plurality of first electrical connectors and a first molding material. The die includes a first surface and a second surface opposite to the first surface, and the die is bonded to the interposer through the first surface. The protective layer is disposed on the second surface of the die. The first electrical connectors are disposed aside the die. The first molding material is disposed aside the die, the protection layer and the first electrical connectors.
Claims20
A semiconductor package, comprising:
- an interposer;
- a die, comprising a first surface and a second surface opposite to the first surface, the die bonded to the interposer through the first surface;
- a protective layer, disposed on the second surface of the die, wherein an outer sidewall of the protective layer is substantially flush with an outer sidewall connecting to the first surface and the second surface of the die;
- a plurality of first electrical connectors aside the die;
- and
- a first molding material, disposed aside the die, the protection layer and the first electrical connectors.
A semiconductor package, comprising:
- an interposer;
- a die bonded to and electrically connected to the interposer, the die having a protective layer thereon;
- and
- a board substrate, wherein the interposer is bonded to and electrically connected to the board substrate, and the die is disposed between the interposer and the board substrate and electrically connected to the board substrate through the interposer, wherein the protective layer is disposed between the die and the board substrate, and the protective layer is separated from the board substrate by a gap.
A method of manufacturing a semiconductor package, comprising:
- bonding a die onto an interposer to electrically connect to the interposer, wherein the die has a protective layer thereon, and the die is disposed between the protective layer and the interposer;
- forming a first molding material over the interposer to encapsulate the die, wherein the first molding material covers the protective layer;
- and
- thinning the first molding material while the die is protected by the protective layer.
Dependencies are inferred from the claim text.