Plurality of transistor packages with exposed source and drain contacts mounted on a carrier

A half-bridge module, comprising:

• a carrier comprising a top side, a first source pad and a first drain pad;
• a first transistor package comprising a first source contact surface exposed at a bottom side of the first transistor package, and a first drain contact surface exposed at a top side of the first transistor package, wherein the first transistor package is mounted to the top side of the carrier with the first source contact surface electrically and mechanically contacting the first source pad;
• and
• a second transistor package comprising a second source contact surface exposed at a top side of the second transistor package, and a second drain contact surface exposed at a bottom side of the second transistor package, wherein the second transistor package is mounted to the top side of the carrier with the second drain contact surface electrically and mechanically contacting the first drain pad,
• wherein a portion of the first source pad is exposed at the top side at a first end of the carrier,
• wherein a portion of the first drain pad is exposed at the top side at a second end of the carrier opposite the first end.