Semiconductor package

A semiconductor package, comprising:

• a thermal radiation member;
• a substrate on the thermal radiation member;
• a lead frame on the substrate;
• a semiconductor chip which is disposed on the lead frame and whose bottom surface has a central region and a peripheral region which surrounds the central region;
• and
• a chip pad which is provided on the peripheral region of the bottom surface of the semiconductor chip and which couples the semiconductor chip to the lead frame,
• wherein the lead frame includes:
• a first segment which extends from a bottom surface of the chip pad onto the central region of the bottom surface of the semiconductor chip;
• a second segment which extends from the central region toward an outside of the semiconductor chip;
• and
• a connection segment through which the first segment and the second segment are connected to each other on the central region.

A semiconductor package, comprising:

• a thermal radiation member;
• a substrate on the thermal radiation member;
• a lead frame on the substrate, the lead frame having a hook shape in which a first end of a first segment is connected to a first end of a second segment, the first and second segments extending in a first direction;
• and
• a semiconductor chip which includes a chip pad coupled to the first segment,
• wherein a connection segment that connects the first and second segments to each other is more distant than the chip pad from a first lateral surface of the semiconductor chip, the first lateral surface being adjacent to the chip pad.