Tactile representation device, display panel and display device

A display panel, comprising:

• a back plate and a cover plate disposed opposite to each other;
• a light emitting device, disposed between the back plate and the cover plate;
• and
• a tactile representation device, disposed on a side of the cover plate, wherein the tactile representation device comprises:
• a substrate, comprising a plurality of deformable regions and a plurality of node regions that are alternately disposed in a first direction, wherein the substrate is vibratable to cause the deformable regions to be deformed, and the node regions are not deformed;
• and
• a semiconductor temperature control assembly, comprising a plurality of semiconductor temperature control units disposed on a side of the substrate along the first direction, wherein each of the semiconductor temperature control units comprises a hot terminal electrode, a P-side electrode, an N-side electrode, a P-type semiconductor, and an N-type semiconductor;
• wherein each of the hot terminal electrodes is disposed in each of the deformable regions, each of the P-side electrodes and each of the N-side electrodes are disposed in each of the node regions, the P-type semiconductor is connected to the P-side electrode and the hot terminal electrode, and the N-type semiconductor is connected to the N-side electrode and the hot terminal electrode;
• and
• the semiconductor temperature control assembly is disposed on a side of the cover plate facing towards or away from the back plate.

A display device, comprising a power supply assembly and a display panel, wherein the power supply assembly is configured to supply power to the display panel, and the display panel comprises:

• a back plate and a cover plate disposed opposite to each other;
• a light emitting device, disposed between the back plate and the cover plate;
• and
• a tactile representation device, disposed on a side of the cover plate, wherein the tactile representation device comprises:
• a substrate, comprising a plurality of deformable regions and a plurality of node regions that are alternately disposed in a first direction, wherein the substrate is vibratable to cause the deformable regions to be deformed, and the node regions are not deformed;
• and
• a semiconductor temperature control assembly, comprising a plurality of semiconductor temperature control units disposed on a side of the substrate along the first direction, wherein each of the semiconductor temperature control units comprises a hot terminal electrode, a P-side electrode, an N-side electrode, a P-type semiconductor, and an N-type semiconductor;
• wherein each of the hot terminal electrodes is disposed in each of the deformable regions, each of the P-side electrodes and each of the N-side electrodes are disposed in each of the node regions, the P-type semiconductor is connected to the P-side electrode and the hot terminal electrode, and the N-type semiconductor is connected to the N-side electrode and the hot terminal electrode;
• and
• the semiconductor temperature control assembly is disposed on a side of the cover plate facing towards or away from the back plate.