Semiconductor package with expanded heat spreader

A semiconductor package, comprising:

• a die pad comprising a die attach surface;
• a first lead that is laterally separated from and vertically offset from the die pad;
• a semiconductor die that is mounted on the die attach surface and comprises a first terminal on an upper surface of the semiconductor die that faces away from the die pad;
• an interconnect clip that is electrically connected to the first terminal and to the first lead;
• and
• a heat spreader mounted on top of the interconnect clip,
• wherein the interconnect clip comprises a first planar section that interfaces with the upper surface of the semiconductor die and extends past an outer edge side of the die pad,
• wherein the heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die, and
• wherein the heat spreader laterally extends past a first outer edge side of the die pad that faces the first lead.