Cavity packages
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsShaowu Huang, Javier A. DeLaCruz, Liang Wang, Rajesh Katkar, Belgacem Haba
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Abstract
An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disposed between the integrated device die and the antenna structure. The electrical interconnect can connect the integrated device die and the antenna structure.
Claims23
A method of manufacturing an integrated device package, the method comprising:
- forming a recess in a semiconductor element comprising an antenna structure;
- and
- directly bonding the semiconductor element with an integrated device die without an intervening adhesive, wherein the recess is disposed between the antenna structure and the integrated device die.
A method of manufacturing an integrated device package, the method comprising:
- forming a recess in a semiconductor element comprising an antenna structure, forming the recess comprising etching a portion of the semiconductor element;
- and
- directly bonding the semiconductor element with an integrated device die without an intervening adhesive, wherein the recess is disposed between the antenna structure and the integrated device die.
A method of manufacturing an integrated device package, the method comprising:
- providing a semiconductor element comprising an antenna structure;
- and
- directly bonding the semiconductor element with an integrated device die without an intervening adhesive.
Dependencies are inferred from the claim text.