Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorYoshinori Uezato
Life of this patent
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Abstract
A semiconductor module, including a ceramic board, a circuit pattern metal plate formed on a principal surface of the ceramic board, an external connection terminal bonded, via a solder, to the circuit pattern metal plate, and a low linear expansion coefficient metal plate located between the circuit pattern metal plate and the external connection terminal. The circuit pattern metal plate has a first edge portion and a second edge portion, which are opposite to each other and are respectively at a first side and a second side of the circuit pattern metal plate. The low linear expansion coefficient metal plate has a linear expansion coefficient lower than a linear expansion coefficient of the circuit pattern metal plate.
Claims15
A semiconductor module comprising:
- a ceramic board;
- a circuit pattern metal plate formed on a principal surface of the ceramic board, the circuit pattern metal plate having a first edge portion and a second edge portion, which are opposite to each other and are respectively at a first side and a second side of the circuit pattern metal plate;
- an external connection terminal including a bonded portion that has a bonding surface bonded, via a solder, to the first or second side of the circuit pattern metal plate;
- and
- a low linear expansion coefficient metal plate located between the circuit pattern metal plate and the external connection terminal, the low linear expansion coefficient metal plate having a linear expansion coefficient lower than a linear expansion coefficient of the circuit pattern metal plate, wherein
- in a plan view of the semiconductor module, a periphery of the bonding surface overlaps the low linear expansion coefficient metal plate.
Dependencies are inferred from the claim text.