Dimension measurement apparatus, dimension measurement program, and semiconductor manufacturing system

A dimension measurement apparatus that measures a dimension of a semiconductor device having a repetitive pattern from a cross-sectional image of the semiconductor device, the dimension measurement apparatus comprising:

• a processor;
• a memory;
• and
• a dimension measurement program that is stored in the memory and measures a dimension of the semiconductor device by being executed by the processor, wherein
• the dimension measurement program includes a model estimation unit and a dimension measurement unit,
• the model estimation unit outputs, by a first image recognition model, a first labeled image in which the cross-sectional image includes a first plurality of labeled points on a contour line and a background, and outputs, by a second image recognition model, a second labeled image in which the cross-sectional image includes a second plurality of labeled points in the background and a first plurality of feature points which include said first plurality of labeled points on the contour line, said first plurality of feature points defining one of a plurality of unit patterns constituting the repetitive pattern, and
• the dimension measurement unit uses coordinates of the contour line from the first labeled image and coordinates of the first plurality of feature points from the second labeled image to obtain a second plurality of feature points on the contour line, and measures a dimension defined as a distance between a predetermined point of the first plurality of feature points and a predetermined point of the second plurality of feature points.

A dimension measurement program that causes a computer to execute processing of measuring a dimension of a semiconductor device having a repetitive pattern from a cross-sectional image of the semiconductor device, the dimension measurement program comprising:

• a first step of outputting, by a first image recognition model, a labeled image in which the cross-sectional image is labeled for each region of a plurality of regions, each said region including one of a plurality of unit patterns located therein;
• a second step of outputting, by a second image recognition model, coordinates where the plurality of unit patterns constituting the repetitive pattern are respectively located in the cross-sectional image;
• and
• a third step of using the labeled image and the coordinates where each of the unit patterns is located to obtain coordinates of a plurality of feature points defined in advance for each of the unit patterns, and measuring a dimension defined as a distance between two predetermined points among the plurality of feature points.

A dimension measurement program that causes a computer to execute processing of measuring a dimension of a semiconductor device having a repetitive pattern from a cross-sectional image of the semiconductor device, the dimension measurement program comprising:

• a first step of outputting, by a first image recognition model, a first labeled image in which the cross-sectional image is labeled in a contour line and a background;
• a second step of outputting, by a second image recognition model, a second labeled image in which the cross-sectional image is labeled in a background and a first plurality of feature points defined for each of a plurality of unit patterns constituting the repetitive pattern;
• and
• a third step of using coordinates of the contour line from the first labeled image and coordinates of a first plurality of feature points from the second labeled image to obtain coordinates of a second plurality of feature points, and measuring a dimension defined as a distance between a predetermined point of the first plurality of feature points and a predetermined point of the second plurality of feature points.