Semiconductor package having exposed redistribution layer features and related methods of packaging and testing

A method, comprising:

• providing a semiconductor package for a semiconductor device having at least one testing bond pad and at least one functional bond pad on an active surface of the semiconductor device, the at least one testing bond pad to enable testing electrical circuitry of the semiconductor device and the at least one functional bond pad to enable functions of the electrical circuitry,
• placing at least one probe needle in electrical and physical contact with at least one terminal of the semiconductor package, the at least one terminal of the semiconductor package to electrically couple with the at least one testing bond pad of the semiconductor device;
• providing one or more test electrical signals from the at least one probe needle to the semiconductor package through the at least one terminal;
• and
• detecting signals indicative of a charge loss or programming margin shift via the at least one terminal of the semiconductor package.

A method, comprising:

• providing a semiconductor package for a semiconductor device having at least one testing bond pad and at least one functional bond pad on an active surface of the semiconductor device, the at least one testing bond pad to enable testing electrical circuitry of the semiconductor device and the at least one functional bond pad to enable functions including reprogramming electrical circuitry of the semiconductor device;
• providing one or more test signals to a first portion of an exposed first redistribution material electrically coupled to the at least one testing bond pad of the semiconductor device;
• detecting signals indicative of a charge loss or programming margin shift;
• and
• reprogramming circuitry of the semiconductor device responsive to the detected signals by providing reprogramming signals to an exposed second redistribution material electrically coupled to the at least one functional bond pad of the semiconductor device.